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AI final inspection equipment

Applied to final visual inspection of SMT-PCBA assemblies: scan codes for upload and binding, then collect and place the boards into blister packs. 1. Scan the QR code; MES uploads the data. 2. Inspect the front and back surfaces of each board for appearance defects. 3. Collect and arrange the finished boards on trays.

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Category:

NG/OK unloader

Product Description

- Commodity name: AI final inspection equipment
Applied to final visual inspection of SMT-PCBA assemblies: scan codes for upload and binding, then collect and place the boards into blister packs. 1. Scan the QR code; MES uploads the data. 2. Inspect the front and back surfaces of each board for appearance defects. 3. Collect and arrange the finished boards on trays.
Characteristics

1. Compatible with both large and small board modes
2. Features the most mature AI models in the 3C electronics industry; identical or similar components can be used directly without any additional training.
3. Throughput: ≥95% Detection rate: meets 99.9%
4. Different components require different exposure settings; optimize exposure for each component accordingly.
5. Adopts FOV mode, with the camera featuring independent XY axes.
6. Automatically bind the barcode to the system, seal the carton, and automatically print the barcode for placement on the carton.
7. The component comes with a component library for quick retrieval, supports offline programming, and enables offline debugging to reduce false alarms.
8. Equipped with a cache location: after a second inspection by personnel confirms OK, the item can be re-put into storage; if the personnel inspection results in NG, the item can be transferred to the repair station for verification (NG belt).
9. Remote inspection capability: Personnel can remotely inspect multiple production lines simultaneously, and with the built-in caching function, any board identified as NG on the conveyor line is automatically flagged, significantly reducing the labor required for post-inspection sorting.

Parameters
- External dimensions (mm): X1500*Y1900*H1800
- Operating voltage: AC 220 V / 50/60 Hz
- Orbit altitude: (mm) 910 ± 30
- Air supply: 4–6 bar
- Compatible product dimensions (mm): Small-board mode: 60×80
- Large slab mode: 230*100
- Blister box compatible dimensions: L420*W320 (custom orders accepted)
- Production Capacity – Mobile Phone Small-Board Mode: 60×80, UPH ≥ 650 pcs
- Large-panel mode: 230×100, UPH ≥ 280 pcs
- Transmission direction: L-R; R-L (as specified by the customer)
- Track mode: single-track feeding
- MES integration: Scan SN to integrate with MES;
- Label printing: Automatic printing of intermediate-box labels;
- Visual inspection items: missing or deformed shielding cover, scratches (≥10 mm in length), dirt, and missing auxiliary materials.
- /Chip misalignment/Abnormal damage due to chip impact/Shield cover lift (0.5 mm)/Burrs ±0.1 mm; exposed copper must not protrude/Board edge inspection after singulation (±0.12 mm)
- 2D Inspection: Each of the upper and lower CCD modules shall be equipped with two sets of 2D vision cameras, each featuring a color high-definition camera with resolution of 12 megapixels or higher.
- 3D inspection: one CCD module (3D) each for the top and bottom
- Software: 2D/3D with SPC integrated management capabilities, generating daily and weekly reports that are readily accessible.
- The software features offline re-inspection functionality; the home page must display metrics such as input, output, yield, CT, MES information, and real-time report anomaly alerts; operation logs and anomaly alerts can be stored locally or uploaded to a server.