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Multi-functional Plating Buffer Machine

Applied in PCBA manufacturing processes, the production-line PCBA is loaded into a blister tray (by the unloading machine) or removed from the blister tray and fed into the production line (by the loading machine). Alternatively, it can be used in a flow-line production system to balance production efficiency between the fixture assembly/disassembly machine and the board-splitting machine, serving as a PCBA buffer.

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NG/OK unloader

Product Description

- Commodity name: Multi-functional Plating Buffer Machine
Applied in PCBA manufacturing processes, the production-line PCBA is loaded into a blister tray (by the unloading machine) or removed from the blister tray and fed into the production line (by the loading machine). Alternatively, it can be used in a flow-line production system to balance production efficiency between the fixture assembly/disassembly machine and the board-splitting machine, serving as a PCBA buffer.
Characteristics

1. Sophisticated product design and an ultra-compact footprint make it suitable for the vast majority of workshop environments.
2. Simple programming with tray-loading cache, material loading and tray placement, and material collection and tray placement. Multi-functional, suitable for multiple scenarios in PCBA production lines.
3. Configure the CCD for identification and precise pick-and-place of PCBA from blister trays.
4. Enable continuous replenishment and removal of blister packs without shutting down the machine.

Parameters
- External dimensions (mm): L800 × W1850 × H1800 mm
- Operating voltage: AC 220 V / 50/60 Hz; Track height (mm): 910 ± 20
- Air supply: 4–6 bar
- Product dimensions (mm): L50×W50 min to L300×W250 mm max; plate thickness: 1–6 mm; cycle time ≤18 s.
- Transmission direction: L-R (as specified by the customer)
- Communication Port: Standard SMEMA Interface
- Control System: Industrial PC + PLC
- Communication method: Standard SMEMA interface + Ethernet