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Solder Ball Cleaning Machine

After PCBs undergo selective soldering or wave soldering, residual solder balls may adhere to the PCB surface or between components. These residual solder balls can inadvertently bridge circuits between components, leading to short circuits and other unintended failures. This cleaning machine effectively removes all residual solder balls, thereby preventing such accidents caused by solder ball formation.

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Category:

NG/OK unloader

Product Description

- Commodity name: Solder Ball Cleaning Machine
After PCBs undergo selective soldering or wave soldering, residual solder balls may adhere to the PCB surface or between components. These residual solder balls can inadvertently bridge circuits between components, leading to short circuits and other unintended failures. This cleaning machine effectively removes all residual solder balls, thereby preventing such accidents caused by solder ball formation.
Characteristics

1. Cleaning method: brush + vacuum + static elimination + monitoring system

2. Dust-removal brush: antistatic material

3. Anti-static device on the XY motion mechanism: one set

4. Vacuum Recovery: Foreign Object Blockage Alarm System

5. Brush height: Automatic brush height compensation

6. Programming methods: Supports programming via image file import and supports offline programming.

7. Brush Monitoring: The equipment can trigger an alarm, issue a notification, or shut down based on preset threshold values.

8. Brush Monitoring: The service life of the brushes is managed through automated statistical monitoring, with real-time integration between the control system and the MES system.

9. Brush Z-axis working height: 52 mm

10. Brush size: Diameter 12 mm (customization available)

Parameters
- External dimensions (mm): L1000 × W1450 × H1600
- Operating voltage: AC 220 V / 50/60 Hz
- Docking height (mm): 910 ± 30 mm
- Air supply: 4–6 bar
- Compatible board sizes: 50 mm × 50 mm to 600 mm × 550 mm
- Transmission method: metal chain
- Operating method: Human-machine interface
- Control System: PLC + Buttons
- Communication method: Standard SMEMA interface
- Transmission direction: bidirectional—left-to-right and right-to-left
- Fixed track, width adjustment method: The fixed track is located at the front of the machine and features automatic width adjustment.
- Clearance is reserved on both sides of the substrate: 180 mm on Side A and 60 mm on Side B.