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Semiconductor magazine unloading machine

Applied to the magazine loading and unloading process in the semiconductor industry, it replaces manual operations, reduces the number of dedicated operators, and lowers labor costs.
Cutting machine: The processed substrates are sequentially collected into magazines.

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Semiconductor equipment

Product Description

- Commodity name: Semiconductor magazine unloading machine
Applied to the magazine loading and unloading process in the semiconductor industry, it replaces manual operations, reduces the number of dedicated operators, and lowers labor costs. <br/> Cutting machine: The processed substrates are sequentially collected into magazines.
Characteristics
1. It can be integrated with AGVs to enable unmanned management of pallet and carton material circulation.
2. Dual-track operation.
3. Optimized design for semiconductor substrates.
4. A torque-controlled servo motor is used to push the plate.
5. Optimized design for semiconductor substrates.
Parameters
- External dimensions: L 1075 W 1187 H 1550
- Applicable product size range (mm): L50*W50–L175*W128
- Transfer height: 910 mm ± 30
- Magazine capacity: 5 rounds × 2
- Track: Dual-track
- Conveying medium: ESD belt
- Control: Human-Machine Interface + PLC
- Production mode: Online